Invention Grant
- Patent Title: Circuit board, electronic component and method of manufacturing circuit board
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Application No.: US14722084Application Date: 2015-05-26
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Publication No.: US09832885B2Publication Date: 2017-11-28
- Inventor: Myung Sam Kang , Ki Jung Sung , Seung Yeop Kook , Seung Eun Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2014-0063045 20140526
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12 ; H05K3/40 ; H05K1/18 ; H05K1/09 ; H05K3/10 ; H05K1/11 ; H05K3/18 ; H05K3/24
Abstract:
Disclosed is a circuit board having a contact pad for connection with an external device, which protrudes from an upper surface of an outermost insulating layer. A device can be mounted on the circuit board, and a connection terminal of the device can be connected to the contact pad of the circuit board by a wire etc.
Public/Granted literature
- US20150342047A1 CIRCUIT BOARD, ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING CIRCUIT BOARD Public/Granted day:2015-11-26
Information query
