Invention Grant
- Patent Title: Pressure locking board level shield assemblies
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Application No.: US15401833Application Date: 2017-01-09
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Publication No.: US09832915B2Publication Date: 2017-11-28
- Inventor: Shelby Ball
- Applicant: Laird Technologies, Inc.
- Applicant Address: US MO Earth City
- Assignee: Laird Technologies, Inc.
- Current Assignee: Laird Technologies, Inc.
- Current Assignee Address: US MO Earth City
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
According to various aspects, exemplary embodiments are disclosed of board level shields. In an exemplary embodiment, a board level shield (BLS) includes a fence and a lid. The fence is solderable to a printed circuit board (PCB). When the lid is engaged to the fence that has been soldered to the PCB, the BLS provides substantial electromagnetic interference (EMI) shielding protection to the components covered by the BLS. The lid may be constructed of a frame and a cover. The cover may be a film or foil. The lid may attach to the fence via a one way directional latching mechanism, which may be enhanced by the use of one or more interior downward tabs on the lid that meet one or more inward protrusions from the fence to create pressure on the lid and fence.
Public/Granted literature
- US20170231123A1 PRESSURE LOCKING BOARD LEVEL SHIELD ASSEMBLIES Public/Granted day:2017-08-10
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