Invention Grant
- Patent Title: Applying dimensional reduction to spectral data from polishing substrates
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Application No.: US15400183Application Date: 2017-01-06
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Publication No.: US09833874B2Publication Date: 2017-12-05
- Inventor: Jeffrey Drue David , Boguslaw A. Swedek , Benjamin Cherian
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: G01B5/02
- IPC: G01B5/02 ; B24B49/00 ; B24B37/013 ; B24B49/12 ; H01L21/66 ; H01L21/306
Abstract:
A plurality of spectra reflected from one or more substrates at a plurality of different positions on the one or more substrates are represented in the form of a first matrix, and the first matrix is decomposed into products of at least two component matrixes of a first set of component matrixes. The dimensions of each of the at least two component matrixes is reduced to produce a second set of component matrixes containing the at least two matrixes with reduced dimensions.
Public/Granted literature
- US20170113320A1 APPLYING DIMENSIONAL REDUCTION TO SPECTRAL DATA FROM POLISHING SUBSTRATES Public/Granted day:2017-04-27
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