Invention Grant
- Patent Title: Polishing apparatus and polishing method
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Application No.: US14195020Application Date: 2014-03-03
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Publication No.: US09833876B2Publication Date: 2017-12-05
- Inventor: I-Pin Chan
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: B24B53/017
- IPC: B24B53/017 ; B24B37/34

Abstract:
Embodiments of a polishing apparatus are provided. The polishing apparatus includes a polishing pad having a polishing surface. The polishing apparatus also includes a dispensing device including a dispensing arm located over the polishing pad and a liquid nozzle disposed on the dispensing arm. The liquid nozzle is configured to dispense washing liquid onto the polishing surface along a dispensing direction. The dispensing direction has an acute angle with respect to the polishing surface.
Public/Granted literature
- US20150246425A1 POLISHING APPARATUS AND POLISHING METHOD Public/Granted day:2015-09-03
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