Invention Grant
- Patent Title: Method of path planning for array-based pick-and-place performed with robotic arm and compensator for use with the method
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Application No.: US15062478Application Date: 2016-03-07
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Publication No.: US09833906B2Publication Date: 2017-12-05
- Inventor: Chen-Ming Wong , Shu-Hung Liu
- Applicant: HIWIN TECHNOLOGIES CORP.
- Applicant Address: TW Taichung
- Assignee: HIWIN TECHNOLOGIES CORP.
- Current Assignee: HIWIN TECHNOLOGIES CORP.
- Current Assignee Address: TW Taichung
- Agency: Muncy, Geissler, Olds & Lowe PC
- Main IPC: B25J11/00
- IPC: B25J11/00 ; B25J9/16

Abstract:
A method of path planning for array-based pick-and-place performed with a robotic arm is characterized in that: during each instance of the pick-and-place process performed with the robotic arm, an X-axis position sensor and a Y-axis position sensor sense coordinate errors of a pick-and-place point such that a controller calculates a position compensation value according to the sum of vectors of the coordinate errors, corrects the pick-and-place position of the robotic arm according to the position compensation value, and generates the coordinates of the next pick-and-place point. By repeating the aforesaid process flow, it is feasible to perform plenty array-based pick-and-place jobs.
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