Invention Grant
- Patent Title: Metal laminate with polyimide resin and method for manufacturing the same
-
Application No.: US14954724Application Date: 2015-11-30
-
Publication No.: US09833973B2Publication Date: 2017-12-05
- Inventor: Tang-Chieh Huang , Sih-Ci Jheng , Chin-Te Yen
- Applicant: Microcosm Technology CO, LTD.
- Applicant Address: TW Tainan
- Assignee: Microcosm Technology Co, Ltd.
- Current Assignee: Microcosm Technology Co, Ltd.
- Current Assignee Address: TW Tainan
- Agency: Haverstock & Owens LLP
- Priority: TW104121997A 20150707
- Main IPC: B32B15/04
- IPC: B32B15/04 ; B32B7/12 ; B32B37/06 ; B32B37/24 ; B32B38/00 ; H05K1/03 ; H05K3/00 ; H05K3/30 ; H05K1/02 ; H01B3/30 ; B32B37/02 ; B32B7/04 ; B32B15/08 ; B32B27/28 ; C08J5/12 ; H05K3/02 ; B32B37/00

Abstract:
A metal laminate comprising a metal layer and an insulating layer is provided. The insulating layer is disposed on the metal layer and directly contacts the metal layer. The insulating layer is made of a polyimide resin, and the polyimide resin is derived from at least two dianhydrides and at least two diamines. The dianhydride monomers are selected from the group consisting of p-phenylenebis (trimellitate anhydride), 4,4′-(hexafluoroisopropylidene)-diphthalic anhydride, 4,4′-(4,4′-isopropylidenediphenoxy)bis(phthalic anhydride) and the combination thereof. One of the diamine monomers is 2,2′-bis(trifluoromethyl)benzidine, and the other diamine monomers are selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl, 1,3-bis(4-aminophenoxy)benzene, p-phenylenediamine, 4,4′-oxydianiline, 4,4′-methylenedianiline, 4,4′-diaminobenzanilide, 4,4′-diaminodiphenyl-sulfone, m-tolidine, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane and the combination thereof. A molar ratio of the dianhydride monomers to the diamine monomers is between 0.85 and 1.15.
Public/Granted literature
- US20170008254A1 METAL LAMINATE WITH POLYIMIDE RESIN AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2017-01-12
Information query