Invention Grant
- Patent Title: Securing mechanism and method for wafer bonder
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Application No.: US15223500Application Date: 2016-07-29
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Publication No.: US09833980B2Publication Date: 2017-12-05
- Inventor: Steve Canale , David J. Zapp
- Applicant: Skyworks Solutions, Inc.
- Applicant Address: US MA Woburn
- Assignee: Skyworks Solutions, Inc.
- Current Assignee: Skyworks Solutions, Inc.
- Current Assignee Address: US MA Woburn
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B32B37/10 ; B32B38/18 ; H01L21/768 ; H01L21/67 ; H01L21/683 ; H01L21/673 ; B32B38/00 ; H01L21/66
Abstract:
Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.
Public/Granted literature
- US20170028697A1 SECURING MECHANISM AND METHOD FOR WAFER BONDER Public/Granted day:2017-02-02
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