Invention Grant
- Patent Title: Integrated silicone for protecting electronic devices, circuit module using the same and manufacturing method of circuit module
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Application No.: US14537250Application Date: 2014-11-10
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Publication No.: US09834686B2Publication Date: 2017-12-05
- Inventor: Kyungjae Shin , Kiwoong Kim
- Applicant: SAMSUNG SDI CO., LTD.
- Applicant Address: KR Yonign-Si, Gyeonggi-Do
- Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee Address: KR Yonign-Si, Gyeonggi-Do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2013-0141785 20131120
- Main IPC: H05K7/00
- IPC: H05K7/00 ; C09D5/00 ; H05K1/18 ; H05K1/02 ; H05K3/00 ; C08L83/04 ; C08J3/24 ; C08K5/00 ; H01L23/29 ; C08K3/22 ; C08K3/28 ; C08K3/38
Abstract:
An integrated silicone for protecting electronic devices includes a base resin, a thermal initiator, and a photoinitiator.
Public/Granted literature
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