Invention Grant
- Patent Title: Pressure-sensitive adhesive tape
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Application No.: US14629681Application Date: 2015-02-24
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Publication No.: US09834706B2Publication Date: 2017-12-05
- Inventor: Takumi Yutou , Minoru Hanaoka
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-047524 20140311; JP2014-244011 20141202
- Main IPC: C09J7/02
- IPC: C09J7/02 ; C09J133/08 ; C08K5/00 ; C08K5/12

Abstract:
A pressure-sensitive adhesive tape that uses, as a plasticizer, an alternative compound to bis(2-ethylhexyl) phthalate (DOP) and dibutyl phthalate (DBP), having excellent tackiness, and can be unwound satisfactorily, where DOP and DBP are to be restricted under the REACH regulation. The pressure-sensitive adhesive tape includes a poly(vinyl chloride) substrate and a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer is disposed on or over one side of the substrate. The poly(vinyl chloride) substrate contains 10 to 40 percent by weight of bis(2-ethylhexyl) terephthalate. The pressure-sensitive adhesive tape preferably has an unwinding force of 0.4 N/20 mm or less at a tensile speed of 0.3 m/min and an unwinding force of 1.2 N/20 mm or less at a tensile speed of 30 m/min.
Public/Granted literature
- US20150259576A1 PRESSURE-SENSITIVE ADHESIVE TAPE Public/Granted day:2015-09-17
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