An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a socket lid assembly configured to apply a force upon a packaged device received in the socket cavity of the adapter body. A measurement apparatus associated with the socket lid assembly may include a measurement element (e.g., temperature sensing element, compressible element, etc.) that is configured to contact a packaged device received in the socket cavity when the socket lid assembly closes the socket cavity and applies a force upon the packaged device (e.g., a measurement signal is generated with use of the measurement element that is configured to contact the packaged device). An indicator may be configured to display a parameter based on the measurement signal (e.g., a count, a temperature, etc.).