Invention Grant
- Patent Title: Solder bump array probe tip structure for laser cleaning
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Application No.: US14276223Application Date: 2014-05-13
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Publication No.: US09835653B2Publication Date: 2017-12-05
- Inventor: David M. Audette , Dennis M. Bronson, Jr. , Joseph K. V. Comeau , Dustin M. Fregeau , David L. Gardell , Frederick H. Roy, III , James R. Salimeno, III , Timothy D. Sullivan
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Steven J. Meyers
- Main IPC: G01R3/00
- IPC: G01R3/00 ; G01R1/073 ; G01R31/28 ; G01R1/067

Abstract:
A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.
Public/Granted literature
- US20150331014A1 SOLDER BUMP ARRAY PROBE TIP STRUCTURE FOR LASER CLEANING Public/Granted day:2015-11-19
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