Invention Grant
- Patent Title: Signal transmission circuit and printed circuit board
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Application No.: US14766294Application Date: 2013-11-06
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Publication No.: US09836429B2Publication Date: 2017-12-05
- Inventor: Nobuhiko Wakayama , Akio Ikeya
- Applicant: Hitachi, Ltd.
- Applicant Address: JP Tokyo
- Assignee: HITACHI, LTD.
- Current Assignee: HITACHI, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- International Application: PCT/JP2013/080007 WO 20131106
- International Announcement: WO2015/068225 WO 20150514
- Main IPC: G06F13/00
- IPC: G06F13/00 ; G06F13/42 ; H05K1/02 ; G06F13/40

Abstract:
The present invention aims to improve the signal transmission characteristics by shortening the length of the detour path of the return current. The present invention comprises a return current transmission path relative to a signal transmission path for transmitting signals. The signal transmission path includes a signal pad formed on a circuit board surface layer, and signal through-holes formed on the circuit board surface layer and a circuit board inner layer and connected to the signal pad. The return current transmission path includes a ground pad formed on the circuit board surface layer, and a plurality of ground through-holes formed on the circuit board surface layer and the circuit board inner layer and connected to the ground pad and a ground layer of the circuit board inner layer. Each of the ground through-holes is arranged by being separated on either side of the ground pad.
Public/Granted literature
- US20150370748A1 SIGNAL TRANSMISSION CIRCUIT AND PRINTED CIRCUIT BOARD Public/Granted day:2015-12-24
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