In an embodiment of a ceramic electronic component, an external electrode 12 of a capacitor 10 has one first planar part SEa of roughly rectangular profile positioned on a surface that specifies the length dimension of the ceramic chip 11, as well as four second planar parts SEb of roughly rectangular profile positioned on both surfaces that specify the height dimension, and both surfaces that specify the width dimension, of the ceramic chip 11 and also continuing to the first planar part SEa. The second planar part SEb is constituted by a baked metal film 12a formed on the exterior surface of the ceramic chip 11 and a plated metal film 12b formed on the exterior surface of the baked metal film 12a via an adhesive force mitigation film 12c.