Invention Grant
- Patent Title: Composite electronic component and manufacturing method thereof
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Application No.: US14875373Application Date: 2015-10-05
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Publication No.: US09837218B2Publication Date: 2017-12-05
- Inventor: Hong Kyu Shin , Wan Suk Yang , Hyun Sub Oh , Hyoung Sun Ham , Jae Hyuk Choi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0181367 20141216
- Main IPC: H01G15/00
- IPC: H01G15/00 ; H01G4/30 ; H01G9/15 ; H01G4/12 ; H01G9/052
Abstract:
A composite electronic component includes: a tantalum capacitor, a multilayer ceramic capacitor, a sealing part, an anode lead frame, and a cathode lead frame, wherein the anode lead frame includes a step portion that does not contact a first external electrode of the multilayer ceramic capacitor, and the cathode lead frame includes a step portion that does not contact a second external electrode of the multilayer ceramic capacitor.
Public/Granted literature
- US20160172125A1 COMPOSITE ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-06-16
Information query
