Invention Grant
- Patent Title: Ion implantation apparatus and method of controlling ion implantation apparatus
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Application No.: US14605404Application Date: 2015-01-26
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Publication No.: US09837248B2Publication Date: 2017-12-05
- Inventor: Masahide Ooura , Daisuke Imai , Shiro Ninomiya
- Applicant: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO HEAVY INDUSTRIES ION TECHNOLOGY CO., LTD.
- Current Assignee: SUMITOMO HEAVY INDUSTRIES ION TECHNOLOGY CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP2014-014584 20140129
- Main IPC: H01J37/317
- IPC: H01J37/317 ; H01J37/30

Abstract:
In an ion implantation apparatus, an interruption member interrupts an ion beam B in the middle of a beam line. A plasma shower device is provided at the downstream side of the interruption member in the beam line. A control unit causes the interruption member to interrupt the ion beam B during an ignition start period of the plasma shower device. The interruption member may be provided at the upstream side of at least one high-voltage electric field type electrode in the beam line. A gas supply unit may supply a source gas to the plasma shower device. The control unit may start the supply of the source gas from the gas supply unit after the ion beam B is interrupted by the interruption member.
Public/Granted literature
- US20150214007A1 ION IMPLANTATION APPARATUS AND METHOD OF CONTROLLING ION IMPLANTATION APPARATUS Public/Granted day:2015-07-30
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