Invention Grant
- Patent Title: Method and apparatus for heat-treating high dielectric constant film
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Application No.: US15380000Application Date: 2016-12-15
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Publication No.: US09837266B2Publication Date: 2017-12-05
- Inventor: Hikaru Kawarazaki
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JP2015-001302 20150107
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A substrate in which a high-dielectric-constant gate insulator is formed on a silicon substrate with an interface layer film sandwiched in between is housed in a chamber. The method of the invention including: (a) housing the substrate in a chamber; (b) supplying ammonia to the chamber to foam an ammonia atmosphere; and (c) applying flash light to a surface of the substrate housed in the chamber to heat the high dielectric constant film, wherein the flash light applied in said step (c) has a spectral distribution that has a peak in a wavelength range of 200 to 300 nm.
Public/Granted literature
- US20170098543A1 METHOD AND APPARATUS FOR HEAT-TREATING HIGH DIELECTRIC CONSTANT FILM Public/Granted day:2017-04-06
Information query
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