Invention Grant
- Patent Title: Polishing composition
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Application No.: US14442525Application Date: 2013-10-25
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Publication No.: US09837283B2Publication Date: 2017-12-05
- Inventor: Shuugo Yokota , Koichi Sakabe
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Kiyosu-Shi
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Kiyosu-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2012-251521 20121115
- International Application: PCT/JP2013/078967 WO 20131025
- International Announcement: WO2014/077107 WO 20140522
- Main IPC: C09K13/06
- IPC: C09K13/06 ; H01L21/3105 ; C09G1/02 ; C09K3/14
Abstract:
Provided is a polishing composition which exhibits favorable storage stability and polishes a polishing object poor in chemical reactivity at a high speed.The invention is a polishing composition which contains silica having an organic acid immobilized on a surface thereof, a dihydric alcohol having a molecular weight of less than 20,000 and a pH adjusting agent, the polishing composition having a pH of 6 or less.
Public/Granted literature
- US20160293436A1 POLISHING COMPOSITION Public/Granted day:2016-10-06
Information query
