Invention Grant
- Patent Title: Underfill dispensing with controlled fillet profile
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Application No.: US14930032Application Date: 2015-11-02
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Publication No.: US09837292B2Publication Date: 2017-12-05
- Inventor: Chun-Chih Chuang , Jung Wei Cheng , Chun-Hung Lin , Tsung-Ding Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/67
Abstract:
A method includes placing an underfill-shaping cover on a package component of a package, with a device die of the package extending into an opening of the underfill-shaping cover. An underfill is dispensed into the opening of the underfill-shaping cover. The underfill fills a gap between the device die and the package component through capillary. The method further includes, with the underfill-shaping cover on the package component, curing the underfill. After the curing the underfill, the underfill-shaping cover is removed from the package.
Public/Granted literature
- US20160056063A1 UNDERFILL DISPENSING WITH CONTROLLED FILLET PROFILE Public/Granted day:2016-02-25
Information query
IPC分类:
