Invention Grant
- Patent Title: Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
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Application No.: US14330536Application Date: 2014-07-14
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Publication No.: US09837295B2Publication Date: 2017-12-05
- Inventor: Hale Johnson , Gregory George , Michael Brennen
- Applicant: SUSS MicroTec Lithography, GmbH
- Applicant Address: DE
- Assignee: SUSS MicroTec Lithography GmbH
- Current Assignee: SUSS MicroTec Lithography GmbH
- Current Assignee Address: DE
- Agency: Hayes Soloway PC
- Main IPC: B23B31/28
- IPC: B23B31/28 ; H01L21/683 ; H01L21/68 ; H01L21/67
Abstract:
A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.
Public/Granted literature
- US20140318683A1 APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER LEVELING, FORCE BALANCING AND CONTACT SENSING Public/Granted day:2014-10-30
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