Invention Grant
- Patent Title: TIM strain mitigation in electronic modules
-
Application No.: US15161496Application Date: 2016-05-23
-
Publication No.: US09837332B2Publication Date: 2017-12-05
- Inventor: Gerard McVicker , Sri M. Sri-Jayantha
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: McGinn IP Law Group, PLLC
- Agent Louis J. Percello, Esq.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/367 ; H01L23/04 ; H01L23/00 ; H01L23/42
Abstract:
A heat spreading lid including a lid body and a wing portion having a thermal interface material disposed on the wing portion such that the wing portion flexibly moves with the thermal interface material independently from the lid body.
Public/Granted literature
- US20160365297A1 TIM STRAIN MITIGATION IN ELECTRONIC MODULES Public/Granted day:2016-12-15
Information query
IPC分类:
