Invention Grant
- Patent Title: Manufacturing method of semiconductor device and semiconductor device thereof
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Application No.: US15346507Application Date: 2016-11-08
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Publication No.: US09837376B2Publication Date: 2017-12-05
- Inventor: Yeong Beom Ko , Jin Han Kim , Dong Jin Kim , Do Hyung Kim , Glenn Rinne
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2014-0108365 20140820
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L25/00 ; H01L21/683 ; H01L21/311 ; H01L25/065 ; H01L23/498 ; H01L21/48 ; H01L23/538 ; H01L21/78 ; H01L23/31 ; H01L21/56
Abstract:
A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.
Public/Granted literature
- US20170117249A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE THEREOF Public/Granted day:2017-04-27
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