Invention Grant
- Patent Title: Semiconductor device including two or more chips mounted over wiring substrate
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Application No.: US14519753Application Date: 2014-10-21
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Publication No.: US09837377B2Publication Date: 2017-12-05
- Inventor: Sensho Usami , Kazuhiko Shibata , Yutaka Kagaya
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Priority: JP2013-218905 20131022; JP2014-111402 20140529
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/34 ; H01L23/48 ; H01L23/52 ; H01L25/065 ; H01L23/00 ; G11C5/02 ; H01L23/498 ; H01L23/31 ; H01L21/56
Abstract:
A semiconductor device includes a composite chip mounted over the a wiring substrate, the composite chip including a first area and a second area that is provided independently from the first area, the first area including a first circuit formed in the first area, and the second area including a second circuit formed in the second area.
Public/Granted literature
- US20150108637A1 SEMICONDUCTOR DEVICE INCLUDING TWO OR MORE CHIPS MOUNTED OVER WIRING SUBSTRATE Public/Granted day:2015-04-23
Information query
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