A three-dimensional (3D) integrated circuit (IC) package is disclosed that contains a plurality of encapsulated layers stacked upon each other without the use of a substrate(s). Each of the encapsulated layers contains an encapsulating material, a die, an interconnecting interface, and vertical vias. The encapsulating material forms the surfaces of an encapsulated layer and encapsulates the die. The interconnecting interface provides an interface at a surface of the encapsulated layer for the die to electrically connect to other dies or external components. The vertical vias provide a conduction path between interconnecting interfaces of different encapsulated layers.