- Patent Title: Scalable polylithic on-package integratable apparatus and method
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Application No.: US14967231Application Date: 2015-12-11
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Publication No.: US09837391B2Publication Date: 2017-12-05
- Inventor: Surhud Khare , Dinesh Somasekhar , Shekhar Y. Borkar
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard and Mughal LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/10 ; H01L25/00 ; H01L23/538 ; G06F1/12 ; H01L23/522 ; H01L23/528 ; G06F13/40 ; H04L12/933

Abstract:
Described is an apparatus which comprises: a first die including: a processing core; a crossbar switch coupled to the processing core; and a first edge interface coupled to the crossbar switch; and a second die including: a first edge interface positioned at a periphery of the second die and coupled to the first edge interface of the first die, wherein the first edge interface of the first die and the first edge interface of the second die are positioned across each other; a clock synchronization circuit coupled to the second edge interface; and a memory interface coupled to the clock synchronization circuit.
Public/Granted literature
- US20170170153A1 SCALABLE POLYLITHIC ON-PACKAGE INTEGRATABLE APPARATUS AND METHOD Public/Granted day:2017-06-15
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