- Patent Title: Magnetic shield, semiconductor device, and semiconductor package
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Application No.: US14296697Application Date: 2014-06-05
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Publication No.: US09837601B2Publication Date: 2017-12-05
- Inventor: Tetsuhiro Suzuki
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Koutou-ku, Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Koutou-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-132750 20130625
- Main IPC: H01L43/02
- IPC: H01L43/02 ; H01L23/552 ; H01L27/22 ; H01L29/82 ; H01L23/00
Abstract:
Provided is a magnetic shield having improved shielding properties from an external magnetic field. A magnetic shield MS1 has in-plane magnetization as remanent magnetization, and is adapted to generate a perpendicular component in the magnetization direction by applying a magnetic field in the perpendicular direction to the magnetic shield.
Public/Granted literature
- US20140374860A1 MAGNETIC SHIELD, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE Public/Granted day:2014-12-25
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