Invention Grant
- Patent Title: Burn-in socket for packaged integrated circuits
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Application No.: US15273818Application Date: 2016-09-23
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Publication No.: US09837747B2Publication Date: 2017-12-05
- Inventor: Ramana Tadepalli
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Tuenlap D. Chan; Charles A. Brill; Frank D. Cimino
- Main IPC: H01R13/24
- IPC: H01R13/24 ; H01R33/74

Abstract:
An integrated circuit burn-in socket with a spring-loaded contact pin built into the socket base and an electrical receptacle built into the socket lid wherein the electrical receptacle is configured to mate with the spring-loaded contact pin when the burn-in socket is closed. In one implementation, the socket lid is separate from the socket base and with a spring-loaded contact pin built into the socket base and with an electrical receptacle built into the socket lid wherein the electrical receptacle is configured to mate with the spring-loaded contact pin when the socket lid is clamped to the socket base.
Public/Granted literature
- US20170279211A1 BURN-IN SOCKET FOR PACKAGED INTEGRATED CIRCUITS Public/Granted day:2017-09-28
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