Invention Grant
- Patent Title: Speaker module and manufacturing method therefor
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Application No.: US15103227Application Date: 2014-08-15
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Publication No.: US09838816B2Publication Date: 2017-12-05
- Inventor: Xin Wang , Yitao Liu
- Applicant: GOERTEK INC.
- Applicant Address: KR Weifang
- Assignee: GOERTEK INC.
- Current Assignee: GOERTEK INC.
- Current Assignee Address: KR Weifang
- Priority: CN201310659401 20131209
- International Application: PCT/CN2014/084532 WO 20140815
- International Announcement: WO2015/085789 WO 20150618
- Main IPC: H04R1/02
- IPC: H04R1/02 ; H04R31/00 ; H04R9/06 ; B29B11/08 ; B29C45/14 ; H04R9/02 ; B29K21/00 ; B29K75/00 ; B29K105/00 ; B29L31/34

Abstract:
Provided are a speaker module and a manufacturing method therefor. The speaker module comprises a housing and a speaker unit comprising a vibrating diaphragm component and a magnetic circuit component. A front acoustic cavity and a rear acoustic cavity are formed between the speaker unit and the housing. An elastic element is provided on the housing and coupled to the end surface of an open end of the front or rear acoustic cavity. Use of the speaker module can reduce a step of manual fitting of the elastic element, ensure precision and stability, so that the elastic element is not prone to fall off, and tightness between sound outlet hole of the speaker module and sound hole of mobile phone can be ensured. The manufacturing method for the speaker module also can be extended to manufacturing of other structures requiring injection of a soft or rigid material into another material.
Public/Granted literature
- US20160309272A1 SPEAKER MODULE AND MANUFACTURING METHOD THEREFOR Public/Granted day:2016-10-20
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