In an electronic device having a compact form factor, such as a head mounted display device, flexible printed circuits may be utilized to provide interconnects between EMI-generating peripheral components and other components in the device such as those populated on main circuit boards. Coverlays utilized to protect circuit traces and ground planes in the flexible printed circuits are configured with openings that can expose ground planes at various locations throughout the electronic device. Electrical pathways are formed by conductive foam, conductive adhesives, and/or other conductive materials between the exposed ground planes and a device ground to establish multiple ground loops throughout the device that shunt EMI energy that is generated by electronic components and circuits during device operation. The coverlay openings can be positioned on the flexible printed circuits so that the lengths of the ground loops are minimized to enhance overall EMI emission management performance.