Invention Grant
- Patent Title: System of package (SoP) module and mobile computing device having the SoP
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Application No.: US14793384Application Date: 2015-07-07
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Publication No.: US09839127B2Publication Date: 2017-12-05
- Inventor: Heung Kyu Kwon , Kyoung Mook Lim
- Applicant: Heung Kyu Kwon , Kyoung Mook Lim
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2014-0142509 20141021
- Main IPC: H05K1/18
- IPC: H05K1/18 ; G01R31/28 ; G06F1/16 ; H01L23/552 ; H01L25/065 ; H01L23/31 ; H05K1/02 ; H05K1/11
Abstract:
A system on package SoP module includes a printed circuit board (PCB) having a first side and an opposing second side, a first IC attached to the first side, a second IC attached to the second side. The PCB also provides electrical paths for connecting the first IC and the second IC. Conductors by which the second IC is attached to the PCB also allow for electrical testing of the first IC when the SoP is in a system level state.
Public/Granted literature
- US20160113115A1 SYSTEM OF PACKAGE (SoP) MODULE AND MOBILE COMPUTING DEVICE HAVING THE SoP Public/Granted day:2016-04-21
Information query
