Invention Grant
- Patent Title: Thermal ducting system
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Application No.: US13891351Application Date: 2013-05-10
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Publication No.: US09839155B2Publication Date: 2017-12-05
- Inventor: James N. Fleming , Timothy Goldsberry , Mark Shurhay , Max W. Hibner
- Applicant: Panduit Corp.
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Agent Christopher S. Clancy; James H. Williams; Christopher K. Marlow
- Main IPC: H05K7/20
- IPC: H05K7/20 ; B23P19/00
Abstract:
A thermal ducting system for electronic equipment in an electronic equipment enclosure is provided. The thermal ducting system includes a top duct, a bottom duct spaced apart from the top duct, a side duct extending from the top duct to the bottom duct and along an intake side of the electronic equipment, and at least one baffle positioned in the side duct.
Public/Granted literature
- US20130309957A1 Thermal Ducting System Public/Granted day:2013-11-21
Information query
