Invention Grant
- Patent Title: Circuit board assemblies
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Application No.: US15091693Application Date: 2016-04-06
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Publication No.: US09839156B2Publication Date: 2017-12-05
- Inventor: Kris H. Campbell , Shin Katsumata , Mark H. Severson
- Applicant: Hamilton Sundstrand Corporation
- Applicant Address: US NC Charlotte
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US NC Charlotte
- Agency: Locke Lord LLP
- Agent Joshua L. Jones; Daniel J. Fiorello
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/473
Abstract:
A circuit board arrangement includes a deflector configured to guide flow over an electronic component on a circuit board disposed in an air flow. A method for thermal management of a circuit board includes modifying an air flow over the circuit board to increase speed or direction the air flow over a component of the circuit board using a deflector.
Public/Granted literature
- US20170295669A1 CIRCUIT BOARD ASSEMBLIES Public/Granted day:2017-10-12
Information query
