An imprint apparatus molds and cures an imprint material on a substrate using a mold to thereby form a pattern on the substrate. The apparatus includes a first drive mechanism configured to apply a force in a planar direction of the mold and change the planar shape of the pattern portion formed in the mold, and a second drive mechanism configured to deform the mold about an axis (for example, the Y axis) that is orthogonal to the pressing direction of the mold and the uncured resin (for example, the Z axis) and a direction of the force applied by the first drive mechanism (for example, the X axis).