Invention Grant
- Patent Title: Method and structure for enabling high aspect ratio sacrificial gates
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Application No.: US15131688Application Date: 2016-04-18
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Publication No.: US09842739B2Publication Date: 2017-12-12
- Inventor: Kangguo Cheng , Ryan O. Jung , Fee Li Lie , Jeffrey C. Shearer , John R. Sporre , Sean Teehan
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Steven J. Meyers
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L29/66 ; H01L27/088 ; H01L29/04 ; H01L29/16 ; H01L29/423 ; H01L29/78 ; H01L21/3213

Abstract:
Sacrificial gate structures having an aspect ratio of greater than 5:1 are formed on a substrate. In some embodiments, each sacrificial gate structure straddles a portion of a semiconductor fin that is present on the substrate. An anchoring element is formed orthogonal to each sacrificial gate structure rendering the sacrificial gate structures mechanically stable. After formation of a planarization dielectric layer, each anchoring element can be removed and thereafter each sacrificial gate structure can be replaced with a functional gate structure.
Public/Granted literature
- US20160233095A1 METHOD AND STRUCTURE FOR ENABLING HIGH ASPECT RATIO SACRIFICIAL GATES Public/Granted day:2016-08-11
Information query
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