An electronic module including a semiconductor unit situated in a plastic housing, an electrically conductive plate system, via which the semiconductor unit may be supplied with electrical power, the electrically conductive plate system being connected in a planar fashion to a heat-generating integrated circuit of the semiconductor unit via a heat coupler; and the electrically conductive plate system being designed in such a way that it dissipates the heat generated by the heat-generating integrated circuit of the semiconductor unit to the plastic housing. A method for manufacturing a corresponding electronic module is also described.