A component mounting apparatus crimps a component to a transparent substrate. The component is mounted on the transparent substrate through a photo-modifiable resin portion. The component mounting apparatus includes a receiving portion that receives a surface of the substrate by an upper surface of a transparent member, a pressing portion that presses the component against the substrate, an emission portion that emits light to the photo-modifiable resin portion through the transparent member, and a control portion that controls a timing when the pressing portion starts pressing of the component and a timing when the emission portion starts emission of the light so that the emission of the light is started a predetermined differential time earlier or later than the start of the pressing of the component.