Invention Grant
- Patent Title: Tag mounted distributed headset with electronics module
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Application No.: US14918969Application Date: 2015-10-21
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Publication No.: US09843660B2Publication Date: 2017-12-12
- Inventor: Bryan Michael DiPiazza , Vinh-Duy Thai Nguyen , Matthew W. Shope , Graham Peter Byrne
- Applicant: Hand Held Products, Inc.
- Applicant Address: US SC Fort Mill
- Assignee: Hand Held Products, Inc.
- Current Assignee: Hand Held Products, Inc.
- Current Assignee Address: US SC Fort Mill
- Agency: Additon, Higgins & Pendleton, P.A.
- Main IPC: H04M1/05
- IPC: H04M1/05 ; H04M1/60

Abstract:
A device has a communication link, a headset, and an electronics module. The headset is connected to the communication link and has a speaker, and a microphone. The electronics module is connected to the communication link and has a housing with an information conveying tag positioned on a surface, a processor communicatively coupled to the headset through the communication link, a battery, and a wireless transceiver communicatively coupled with a remote terminal.
Public/Granted literature
- US20160191684A1 TAG MOUNTED DISTRIBUTED HEADSET WITH ELECTRONICS MODULE Public/Granted day:2016-06-30
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