Invention Grant
- Patent Title: Mounting substrate
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Application No.: US15185099Application Date: 2016-06-17
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Publication No.: US09847173B2Publication Date: 2017-12-19
- Inventor: Masaaki Taniguchi , Yasuji Yamamoto , Takahiro Ishibashi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2015-128854 20150626; JP2016-077394 20160407
- Main IPC: H01G4/248
- IPC: H01G4/248 ; H01G4/008 ; H01G4/12 ; H01G4/30 ; H01G4/232 ; H05K1/02 ; H05K1/11 ; H05K3/34

Abstract:
A multilayer ceramic capacitor connected to an output electrode and an input electrode of a mounting substrate includes a laminated body. In the laminating direction of the laminated body, the shortest distance from an outer first internal electrode to the surface of an external electrode on the side closer to a first principal surface, and the shortest distance from an outer second internal electrode to the surface of an external electrode on the side closer to a second principal surface are each about 40 μm or less. In the width direction of the laminated body, the shortest distance from an end of an internal electrode to the surface of the external electrode on the side closer to a first side surface, and the shortest distance from an end of an internal electrode to the surface of the external electrode on the side closer to a second side surface are each about 40 μm or less.
Public/Granted literature
- US20160381802A1 MOUNTING SUBSTRATE Public/Granted day:2016-12-29
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