Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures are disclosed. In one exemplary embodiment, a three-dimensional integrated circuit structure includes a plurality of integrated circuit chips stacked one on top of another to form a three-dimensional chip stack, a thermoelectric cooling daisy chain comprising a plurality of vias electrically connected in series with one another formed surrounding the three-dimensional chip stack, a thermoelectric cooling plate electrically connected in series with the thermoelectric cooling daisy chain, and a heat sink physically connected with the thermoelectric cooling plate.