Invention Grant
- Patent Title: Enhancing barrier in air gap technology
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Application No.: US14831897Application Date: 2015-08-21
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Publication No.: US09847295B2Publication Date: 2017-12-19
- Inventor: Wei Lin , Takeshi Nogami
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent L. Jeffrey Kelly
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L21/4763 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/532 ; H01L21/768 ; H01L23/522 ; H01L23/528

Abstract:
A semiconductor structure including a first metal line and a second metal line in a dielectric layer, the first metal line and the second metal line are adjacent and within the same dielectric level; an air gap structure in the dielectric layer and between the first metal line and the second metal line, wherein the air gap structure includes an air gap oxide layer and an air gap; and a barrier layer between the air gap structure and the first metal line, wherein the barrier layer is an oxidized metal layer.
Public/Granted literature
- US20150371954A1 ENHANCING BARRIER IN AIR GAP TECHNOLOGY Public/Granted day:2015-12-24
Information query
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