In accordance with the disclosed semiconductor chip and multi-chip module, signal transmission is made possible between semiconductor chips that are placed on a plane so as to be adjacent to each other through inductive coupling without affecting other coils such as in an oscillation circuit or an antenna circuit for RF communication. A multilayer solenoid coil, where a plane of the coil formed in a multilayer wiring structure in a semiconductor body is parallel to a main surface of the semiconductor body, is formed along at least one side end surface of the semiconductor body.