Invention Grant
- Patent Title: Plated lead frame including doped silver layer
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Application No.: US15187314Application Date: 2016-06-20
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Publication No.: US09847468B1Publication Date: 2017-12-19
- Inventor: Yu Lung Lam , Yiu Fai Kwan , Ching Man Tsui , Ho Ki Yeung
- Applicant: ASM Technology Singapore Pte Ltd
- Applicant Address: SG Singapore
- Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
- Current Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Ostrolenk Faber LLP
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H01L33/62 ; H01L21/48 ; H01L23/495 ; H01L21/288
Abstract:
A lead frame comprises a substrate comprising copper and includes a layer of bright silver is plated onto the substrate. A layer of doped bright silver is thereafter plated over a top surface of the layer of bright silver for enhancing the performance of LED devices utilizing the lead frame.
Public/Granted literature
- US20170365759A1 PLATED LEAD FRAME INCLUDING DOPED SILVER LAYER Public/Granted day:2017-12-21
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