Invention Grant
- Patent Title: Solder in cavity interconnection technology
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Application No.: US14269571Application Date: 2014-05-05
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Publication No.: US09848490B2Publication Date: 2017-12-19
- Inventor: Chuan Hu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard, & Mughal LLP.
- Agent Robert G. Winkle
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/52 ; H05K1/02 ; B23K1/00 ; B23K1/20 ; B23K3/06 ; H01L23/00 ; H05K1/11 ; H05K13/04 ; B23K101/40
Abstract:
An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.
Public/Granted literature
- US20140240943A1 SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY Public/Granted day:2014-08-28
Information query
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