Invention Grant
- Patent Title: Resin composition, copper clad laminate and printed circuit board using same
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Application No.: US14411166Application Date: 2013-08-23
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Publication No.: US09850375B2Publication Date: 2017-12-26
- Inventor: Rongtao Wang , Yu-Te Lin , Wenjun Tian , Ziqian Ma , Wenfeng Lv , Ningning Jia
- Applicant: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO. LTD
- Applicant Address: CN Kunshan
- Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO. LTD.
- Current Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO. LTD.
- Current Assignee Address: CN Kunshan
- Agency: Kilpatrick Townsend & Stockton LLP
- International Application: PCT/CN2013/082192 WO 20130823
- International Announcement: WO2015/024256 WO 20150226
- Main IPC: C08L63/00
- IPC: C08L63/00 ; B32B15/092 ; B32B15/14 ; B32B15/20 ; B32B5/02 ; B32B15/08 ; B32B37/06 ; B32B37/12 ; C08G59/50 ; C08G59/54 ; C08G59/56 ; C08G59/62 ; C08L79/02 ; C08J5/24 ; H05K1/03 ; H05K1/09 ; C09D163/00 ; C09D179/02 ; C08K3/32 ; C08K5/03 ; C08K5/3415 ; C08K5/3492 ; C08K5/49 ; C08G59/24
Abstract:
The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).
Public/Granted literature
- US20160222204A1 RESIN COMPOSITION, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME Public/Granted day:2016-08-04
Information query
