Invention Grant
- Patent Title: High temperature debondable adhesive
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Application No.: US14940291Application Date: 2015-11-13
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Publication No.: US09850409B2Publication Date: 2017-12-26
- Inventor: Wenhua Zhang , Xiaoyan Huang , Shengqian Kong , Xiao Allison Yue , Stephen Hynes , Jiangbo Ouyang , Chunyu Sun
- Applicant: Henkel IP & Holding GmbH , Henkel AG & Co. KGaA , Henkel (China) Investment Co. Ltd.
- Applicant Address: DE Duesseldorf DE Duesseldorf
- Assignee: Henkel AG & Co. KGaA,Henkel IP & Holding GmbH
- Current Assignee: Henkel AG & Co. KGaA,Henkel IP & Holding GmbH
- Current Assignee Address: DE Duesseldorf DE Duesseldorf
- Agent Steven C. Bauman
- Main IPC: C08F2/46
- IPC: C08F2/46 ; C08F2/50 ; C08G61/04 ; C09J143/04 ; C09J5/06 ; C09J183/04 ; B32B7/06 ; B32B7/12 ; B32B37/12 ; B32B38/10 ; C08G77/12 ; C08G77/20 ; C08G77/04 ; C08G77/50

Abstract:
A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.
Public/Granted literature
- US20160068720A1 HIGH TEMPERATURE DEBONDABLE ADHESIVE Public/Granted day:2016-03-10
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