Invention Grant
- Patent Title: Method for manufacturing semiconductor device
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Application No.: US14082505Application Date: 2013-11-18
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Publication No.: US09852906B2Publication Date: 2017-12-26
- Inventor: Toshinari Sasaki , Junichiro Sakata , Hiroki Ohara , Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2009-156411 20090630
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/786 ; H01L21/84 ; H01L21/02 ; H01L29/66 ; H01L27/12

Abstract:
It is an object to provide a highly reliable semiconductor device which includes a thin film transistor having stable electric characteristics. It is another object to manufacture a highly reliable semiconductor device at lower cost with high productivity. In a method for manufacturing a semiconductor device which includes a thin film transistor where a semiconductor layer including a channel formation region using an oxide semiconductor layer, a source region, and a drain region are formed using an oxide semiconductor layer, heat treatment for reducing impurities such as moisture (heat treatment for dehydration or dehydrogenation) is performed so as to improve the purity of the oxide semiconductor layer.
Public/Granted literature
- US20140073085A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2014-03-13
Information query
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