Invention Grant
- Patent Title: Method for forming a reliable solderable contact
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Application No.: US13756427Application Date: 2013-01-31
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Publication No.: US09852940B2Publication Date: 2017-12-26
- Inventor: Martin Standing , Andrew Sawle , Matthew P. Elwin , David P. Jones , Martin Carroll , Ian Glenville Wagstaffe
- Applicant: Infineon Technologies Americas Corp.
- Applicant Address: US CA El Segundo
- Assignee: Infineon Technologies Americas Corp.
- Current Assignee: Infineon Technologies Americas Corp.
- Current Assignee Address: US CA El Segundo
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/31 ; H01L23/00 ; H01L23/498
Abstract:
A silver-containing solderable contact on a semiconductor die has its outer edge spaced from the confronting edge of an epoxy passivation layer so that, after soldering, silver ions are not present and are not therefor free to migrate under the epoxy layer to form dendrites.
Public/Granted literature
- US20130143399A1 Method for Forming a Reliable Solderable Contact Public/Granted day:2013-06-06
Information query
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