Invention Grant
- Patent Title: Wafer processing method
-
Application No.: US15254681Application Date: 2016-09-01
-
Publication No.: US09852949B2Publication Date: 2017-12-26
- Inventor: Tetsukazu Sugiya , Xin Lu
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JP2015-176943 20150908
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/268 ; H01L21/304 ; H01L21/3105 ; H01L21/67 ; B28D5/00 ; B28D5/02 ; H01L21/56 ; H01L21/683 ; H01L23/31
Abstract:
A wafer is divided into device chips each of which is surrounded by a mold resin. The wafer has a plurality of devices arranged like a matrix with a spacing having a predetermined width, the front side of each device being covered with the mold resin, the spacing being filled with the mold resin to form a street between any adjacent ones of the devices. The wafer processing method includes a division start point forming step of forming a division start point along each street at the lateral center of the mold resin filling the spacing and a dividing step of applying an external force to the wafer after performing the division start point forming step, thereby laterally dividing each street into two parts at the division start point to obtain the device chips divided from each other, each device chip being surrounded by the mold resin.
Public/Granted literature
- US20170069537A1 WAFER PROCESSING METHOD Public/Granted day:2017-03-09
Information query
IPC分类:
