Invention Grant
- Patent Title: Packaged semiconductor device having an encapsulated semiconductor chip
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Application No.: US14012585Application Date: 2013-08-28
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Publication No.: US09852961B2Publication Date: 2017-12-26
- Inventor: Chong Yee Tong
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/36 ; H01L23/31 ; H01L23/433 ; H01L23/495 ; H01L23/00
Abstract:
A packaged semiconductor device includes a semiconductor component, first and second heat dissipation means disposed between the semiconductor component and the first and second main faces, respectively, encapsulated by an encapsulant, the shape of the packaged semiconductor device being non-rectangular cuboid.
Public/Granted literature
- US20150061108A1 Packaged Semiconductor Device Public/Granted day:2015-03-05
Information query
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