Invention Grant
- Patent Title: Waterproof electronic device and manufacturing method thereof
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Application No.: US15114431Application Date: 2015-02-04
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Publication No.: US09852962B2Publication Date: 2017-12-26
- Inventor: Hiroyuki Temmei , Mina Amo , Nobutake Tsuyuno , Eiichi Ide , Takeshi Tokuyama , Toshiya Satoh , Toshiaki Ishii , Kazuaki Naoe
- Applicant: Hitachi Automotive Systems, Ltd.
- Applicant Address: JP Hitachinaka-shi
- Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee Address: JP Hitachinaka-shi
- Agency: Crowell & Moring LLP
- Priority: JP2014-033952 20140225
- International Application: PCT/JP2015/053124 WO 20150204
- International Announcement: WO2015/129418 WO 20150903
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L21/288 ; H01L21/56 ; H01L23/00 ; H01L23/29 ; H01L23/31 ; H01L23/473 ; H05K5/06 ; H05K7/20 ; H01L23/433 ; H01L23/373 ; H01L23/495
Abstract:
A waterproof electronic device includes: an electronic component module having an electronic component including a semiconductor element, a heat dissipating member provided on the electronic component in a thermally conductive manner, and an insulating material that surrounds the electronic component in such a manner that one surface of the heat dissipating member is exposed; and a waterproof film that is formed at least on whole surfaces in regions of the electronic component module that are to be immersed in a coolant.
Public/Granted literature
- US20160343636A1 Waterproof Electronic Device and Manufacturing Method Thereof Public/Granted day:2016-11-24
Information query
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