- Patent Title: Wafer level curved image sensors and method of fabricating the same
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Application No.: US15280657Application Date: 2016-09-29
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Publication No.: US09853078B2Publication Date: 2017-12-26
- Inventor: Yun-Hui Yang , Sung-Bo Hwang , Young-Hun Choi
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2016-0067056 20160531
- Main IPC: H01L21/3105
- IPC: H01L21/3105 ; H01L27/146
Abstract:
A wafer level curved image sensor may include a substrate having a central region, a peripheral region, and an edge region, the peripheral region being formed between the central region and the edge region, supporting patterns formed over the substrate, first fixed patterns formed between the supporting patterns, and an image sensing chip formed over the supporting patterns. The supporting patterns and the first fixed patterns, in combination, form a planar lower surface and a concavely-curved upper surface. The image sensing chip has a curved lower surface and a curved upper surface.
Public/Granted literature
- US20170345861A1 WAFER LEVEL CURVED IMAGE SENSORS AND METHOD OF FABRICATING THE SAME Public/Granted day:2017-11-30
Information query
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